Taking the Heat
Could a new design of thermally integrated photonic system deliver the massive bandwidths datacommunications crave, asks Compound Semiconductor
Photonics project aims to make communications ICs five times more efficient.
The result, says project leader Tyndall National Institute, will be faster data transmission at a lower cost
European team secures €5.2 million to develop thermally intelligent circuits
'Thermally Integrated Smart Photonics Systems' (TIPS) project to develop the next generation of photonic devices
Tyndall to Lead $6M Project on Photonic Circuits for Data Transmission
CORK, Ireland, March 2, 2015 — Tyndall National Institute will lead a consortium of researchers in a three-year, €5.2 million (about $5.95 million) European Union-funded project to develop photonic circuits for faster, cheaper data transmission.
Researchers win €5.2m to develop high-bandwidth, thermally intelligent circuits
‘Thermally Integrated Smart Photonics Systems’ project to enable next-generation photonic devices to support global bandwidth growth.
3rd March 2015 Stokes Institute participate in a €5.2 million European project on thermally-integrated photonics
The Stokes Institute is a partner in the EU-funded project ‘Thermally Integrated Smart Photonics Systems (TIPS)’, recently awarded under the Horizon 2020 call for Smart Integration Systems.
European researchers secure €5.2 million in European funding to develop high bandwidth, thermally intelligent circuits
Tyndall National Institute, Ireland, will lead a consortium of European researchers in an EU-funded project to develop intelligent circuits, which can make photonic devices up to 5 times more efficient, resulting in faster data transmission at a lower cost.